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SIMCom Company Profile
Founded in 2002, SIMCom Wireless Solutions Limited has been committed to providing a variety of wireless modules and solutions including 5G, 4G, LPWA, LTE-A, smart module, automotive module, 3G, 2G and GNSS for 20 years. According to the latest M2M report by ABI Research Inc., a well-known U.S. market research company, SIMCom has made the largest shipments of wireless module for 4 consecutive years.
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SIMCom -5G
Concise Overview of the 5G Module Roadmap
This SIMCom 5G module roadmap showcases a comprehensive product matrix covering different technical standards, form factors, and application layers.
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SIMCom-LPWA
LPWA (Low-Power Wide-Area) refers to technology designed for massive IoT deployments that demand ultra-low power consumption and long battery life.
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SIMCom-Automotive
This roadmap outlines SIMCOM's automotive communication strategy from 4G to 5G/C-V2X, segmented by the two major chipset platforms: Qualcomm and ASR.
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SIMCom-LTE450
This module is positioned as the future highly-integrated platform, combining the functionalities of the specialized modules into one flexible unit.
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SIMCom-LTE / LTE-A
SIMCom's 4G/4.5G product line consists of mature Mass Production solutions, covering a wide range of applications.
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SIMCom-WIFI
This page illustrates SIMCom’s product portfolio and development roadmap for Wi-Fi modules designed for LTE (4G) and 5G applications. The roadmap covers products from Mass Production to those In development, highlighting the evolution in module dimensions, performance, supported Wi-Fi standards, and MU-MIMO capabilities.
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SIMCom-GNSS
SIMCom’s GNSS product lineup is designed to cover a full range of positioning needs — from high-precision navigation to compact, low-power IoT devices. The portfolio is grouped into two main categories: Multi-Frequency modules, offering superior accuracy and stability, and Multi-Mode Single-Band modules, optimized for simplicity and efficiency.
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SIMCom-Smart Module
SIMCom Smart Module Series Overview
SIMCom's Smart Module portfolio provides comprehensive solutions ranging from high-computing demands to essential connectivity. The products are categorized into three tiers based on processor performance, display capabilities, and connectivity type to meet diverse embedded application needs.
