SIMCom-Automotive
This roadmap outlines SIMCOM's automotive communication strategy from 4G to 5G/C-V2X, segmented by the two major chipset platforms: Qualcomm and ASR.
This roadmap outlines SIMCOM's automotive communication strategy from 4G to 5G/C-V2X, segmented by the two major chipset platforms: Qualcomm and ASR.
- 5G + C-V2X + AP Flagship Series
This series provides solutions for advanced intelligent driving and connected vehicles (IoV).
- SIM8800/SIM8150 Series (Current/In Dev):
- Specs: LGA package, size approx. 53mm x 53mm.
- Use: Suitable for TCU, infotainment systems, supporting OTA updates and high data throughput.
- SIM8810 (Q1.25): Similar specs to 8800, represents continuous updates in 5G modules.
- 4G Mainstream and Mature Solutions
This section provides highly reliable and cost-effective foundational communications.
- Qualcomm Platform (MDM9628 Chipset)
- SIM7800CE/E & SIM7805CE/E (Current):
- Specs: LGA package, sizes approx. 34mm x 40mm and 33mm x 37.5mm.
- Use: Used for basic Telematics and emergency call systems (eCall/bCall).
- ASR Platform (ASR1806E-I Chipset)
- A7805C/E (Current):
- Specs: LGA package, size approx. 33mm x 37.5mm.
- Use: Provides a second vendor option for 4G solutions, aiding in supply chain risk diversification and cost control.
III. RedCap Lightweight 5G
This represents SIMCOM's future 5G advancement strategy for the mid-range market.
- A8805x (Q3.25):
- Specs: Automotive RedCap module, size approx. 33mm x 37.5mm.
- Use: Serves as a cost-optimized bridge for 5G upgrades, suitable for next-gen Telematics applications that demand low latency and high efficiency without requiring extreme bandwidth.