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SIMCom -5G3
https://www.fae.com.tw/ FAE ELECTRONICS CO., LTD.
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SIMCom -5G

Concise Overview of the 5G Module Roadmap
This SIMCom 5G module roadmap showcases a comprehensive product matrix covering different technical standards, form factors, and application layers.

This SIMCom 5G module roadmap showcases a comprehensive product matrix covering different technical standards, form factors, and application layers.

I. Core Technology and Spectrum Layers

Products are positioned according to their spectrum capability:

  1. Sub 6GHz + mmW (High Performance/Extreme Speed):
    •     Supports both Sub-6GHz and Millimeter Wave (mmW) bands.
    •     Application: Premium FWA (Fixed Wireless Access), enterprise gateways, targeting Gbps-level speeds.
  2. Sub 6GHz (Widespread/Broad Coverage):
    •     Supports Sub-6GHz only.
    •     Application: Most mobile broadband, commercial routers, and Industrial IoT (IIoT), offering wide coverage and high cost-efficiency.

II. Form Factors and Device Compatibility

SIMCom offers various form factors to accommodate different device requirements:

  •     LGA (Land Grid Array)
  •     M.2 (Key B/E) Slot-type
  •     mini-PCIE
  •     LCC+GA (Leadless Chip Carrier + Ground Array)

III. RedCap: The Emerging Standard for IoT

RedCap (Reduced Capability) is the lightweight 5G standard (Rel-17) for the IoT market, currently in development:

  •     Application Layer: Focused on mid-tier IoT devices, such as video surveillance and smart meters.
  •     Competitive Advantage: Replaces traditional 4G solutions by lowering complexity, power consumption, and cost, utilizing 5G's benefits of low latency and long battery life.

 

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